For the past 20 years, I have been working for the semiconductors industry, specifically in backend package development and production around the ASEAN region and Germany.

Aside from being a production manager and a project manager, my technical expertise is in thermosonic wirebonding (Cu, Au and Ag) , ultrasonic wirebonding (Al and Cu), soft solder die attach, lead-free solders and surface mount technology.

I have a Masters in Engineering and Technology Management and an IPMA project management certification Level C. My advocacy is financial planning and poverty alleviation. Interested in films by Pedro Almodovar, reading books by Gabriel Garcia Marquez and networking.