Darren Ho

3+ years for being an on-site Technical Program Manager in SAT (Sub-contractor of Assembly & Test)

6+ years in Flip Chip Packages & Process engineering fields

Specialties

- IC packaging process flows & package design rules, including FC BGA, FC CSP, FC Hybrid, FC PoP, FC PiP/SMP (Stacked-Memory Package), FC MCM, Laminate-based Wire-bonded BGAs & Lead Frame packages

- Low cost package solutions, including Cu pillar, Cu wire, MUF (Molded Underfilling)

- Knowledge of Wafer bumping flows, including Printed & Plated bumps

- Knowledge of standard WLP (Wafer Level Package) & Fan-out WLP process flows

- Knowledge of FC substrates fabrication flows, including Build-ups & Laminates

- Knowledge of advanced packaging technologies, including TSV (Through Silicon Via), Embedded Passive/Active Substrates, 3D stacked packages

Information

- Phone: 1-858-353-4013

- E-mail: [email protected]

- Address: 10954 W Ocean Air Dr Apt #2103, San Diego, CA 92130 U.S.A.