evan yao

Hi, I’m evan. I’m a software engineer living in shanghai. I am a fan of photography, programming, and gaming. Currently I’m interested in programming languages, deep learning compilers, and software-hardware co-work to drive innovation in emerging technologies.

👩🏻‍💻 Work experience

Software Engineer

Enflame*, Shanghai – (2020.4 - now)*

• Hardware Modeling and Performance Benchmark
  • develop a near cycle-accurate ASIC simulator by C++ to validate performance targets for hardware designs. Developed hardware simulator framework to support efficient modeling and verification.
  • develop common performance benchmark (like general 1D/gemm/conv) for perf validation at early asic design.
• Operation Development and Optimization
  • operator library development and optimization, implementing both single operators (broadcast, dot, convolution) and fusion operators (conv+bias+activation, conv+bn).
  • develop conv-gen (like Cutlass) project to generate high-performance 2d compute kernels, achieving better results than hand-written implementations while improving development efficiency and reliability.

Intern

Fosun Aitrox*, Shanghai – (2019.7 - 2019.10)*

Try to apply AI technology to diagnose cervical cancer by training CNN (like YOLO, Faster RCNN) to recognize and locate lesions cells in pathology picture photoed by microscope.

🛠 Skills

Programming Languages

Proficient in C/C++, Python, Perl, and Assembly. Over 3 years of experience with C++ and Python, and 1.5 years with Perl and Assembly.

High Performance Computing

Knowledgeable in DSA/GPU architecture and performance tuning, proficient in key optimization strategies including parallel computing, vectorization, DMA/compute pipeline and latency hiding, familiar with cache optimization, data locality, and synchronous communication techniques.

📚 Education

Master at Shanghai Jiao Tong University

2017 - 2020

Earned a master’s in micro-electronics from Shanghai Jiao Tong University with a 3.91/4 GPA. Built expertise in digital circuits, semiconductor physics, and advanced Verilog coding, establishing a strong foundation in hardware design.

Bachelor at Harbin Institute of Technology

2013 - 2017

Earned a bachelor’s in electronic packaging from Harbin Institute of Technology. Gained expertise in IC manufacturing, including lithography and etching, and hands-on experience in designing, fabricating, and testing technologies like TSV and FlipChip. Built a strong foundation in materials science, micro-welding, and mechanics.