Motion Systems Engineer with 12 years of experience, currently operating at Senior level with expanding system ownership. Specialises in the design, optimisation and integration of high-precision multi-axis motion platforms for advanced semiconductor die-attach and packaging equipment. Deep expertise in servo control, trajectory planning, vibration control, stiffness analysis, resonance management, and the resolution of complex electromechanical issues through rigorous root-cause analysis. Proven ability to mentor and develop younger engineers, establish robust tuning procedures, and drive consistent, best-in-class motion performance across multidisciplinary teams.