Phil Marcoux

Named "Father of Surface Mount Technology" in the US by the IPC.

CEO and Co-Founder of one the first successful Intellectual Property Services Companies.

CEO and Co-Founder of one the first Wafer Level Packaging (WLP) companies, ChipScale, Inc.

CEO and Co-Founder of one the first full-service SMT EMS companies.

Named Inventor and co-owner of 36+ patents covering WLP, Image Sensors and Camera Modules.