Epoxy Chip Underfill adhesive

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. https://www.deepmaterialcn.com/epoxy-based-chip-underfill.html

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